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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas

Shenzhen Xinchenger Electronic Co.,Ltd

High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas

Brand Name : XCE

Model Number : XCE Bh70

Certification : CE,ROHS,FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : MOQ 1 Piece

Price : Negotiation

Payment Terms : T/T, Western Union

Supply Ability : 1000000 pieces per week

Delivery Time : 5-10 working days

Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package

Color : Green

Material : Rogers Material

Layer : Multilayer

Board Size : 8*8cm

Copper Thinknes : 1 oz

Min Line Width : 4 mil

Min Line Space : 4mil

Surface Finish : Immersion Gold

Name : Rogers pcb

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High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas

Quick Detail :

Type Pcb
Material Rogers
Layer 4
Size 8*8cm
Permittivity 2.5
Color Green
Surface Finish Immersion Gold




Features:

RT/duroid® 6202 Laminates

RT/duroid® 6202 high frequency circuit materials are a low loss and low dielectric constant laminate offering electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This often eliminates double etching to achieve tight positional tolerances.

Parameter:

Model Parameter thickness(mm) Permittivity(ER)
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2


Description :

Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger



Data :

Layer 1 to 28 layers
Material type FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness 0.21mm to 7.0mm
Copper thickness 0.5 OZ to 7.0 OZ
Copper thickness in hole >25.0 um (>1mil)

Size

Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Tolerance

Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate UL, ISO 9001, ISO 14001
Special requirements Buried and blind vias+controlled impedance +BGA
Profiling Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

Benefits:

  • Low loss for excellent high frequency performance
  • Extremely low thermal coeffi cient of dielectric constant
  • Tight εr and thickness control. • In-plane expansion coeffi cient matched to copper
  • Excellent electrical and mechanical properties
  • Very low etch shrinkage

Typical Applications:

  • Phase Array Antennas
  • High Reliability Complex Multilayer Circuits
  • Ground Based and Airborne Radar Systems
  • Commercial Airline Collision Avoidance Systems
  • Global Positioning System Antennas
  • Beam Forming Networks

Production Description :

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s



Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.





Product Tags:

double sided board

      

double side pcb

      
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