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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Microwave Radio RF PCB Boards High Frequency Circuit With Taconic CER-10

Shenzhen Xinchenger Electronic Co.,Ltd

Microwave Radio RF PCB Boards High Frequency Circuit With Taconic CER-10

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Brand Name : XCE

Model Number : XCEH

Certification : CE,FCC,Rohs,ISO9001,SGS,UL

Place of Origin : China

MOQ : 1PCS

Price : USD 1-500

Payment Terms : Western Union, L/C, T/T

Supply Ability : 10000000pcs / per month

Packaging Details : inner vacuum package, outer carton box

Board size : 9*11cm

Board THK : 0.6mm

Cu THK : 35UM

Material : Rogers

Application : Microwave

Layer : 4

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Microwave Radio RF PCB Boards High Frequency Circuit With Taconic CER-10​

Specification:

Base Material: high frequency rogers
Layer:4
Thickness: 0.6MM
Copper weight:1OZ
Surface finish: ENIG

Description:

1. at most 99 floor display, with dynamic show to run direction

2. various input ways, 7 segments, BCD code, Gary code, Binary code, ASCII code

3. display any English letter, like B, overload, inspection, etc.

4. doc matrix display, color can be red, yellow, green and blue

Technical requirement:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

Quote requirement:

· Gerber file of the bare PCB board

· BOM (Bill of material) for assembly

· To short the lead time, please kindly advise us if there is any acceptable components substitution.

· Testing Guide & Test Fixtures if necessary

· Programming files & Programming tool if necessary

· Schematic if necessary

Parameter:

Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm

Microwave Radio RF PCB Boards High Frequency Circuit With Taconic CER-10

Microwave Radio RF PCB Boards High Frequency Circuit With Taconic CER-10


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