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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Immersion Gold Rogers PCB Rigid Printed Circuit Board Fabrication

Shenzhen Xinchenger Electronic Co.,Ltd

Immersion Gold Rogers PCB Rigid Printed Circuit Board Fabrication

Brand Name : XCE

Model Number : XCER

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Color : gold

Min line space : 3mil

Min line width : 3mil

Copper thickness : 35um

Size : 6*4cm

Board THK : 1.0MM

Panel : 2*3

Surface finish : ENIG

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Immersion Gold Rogers PCB Rigid Printed Circuit Board Fabrication


Quick Detail:


Material: RogersNumber of layer: 4
Model: XCERBrand: XCE
Name: Rogers PCBOrigin: shenzhen

Parameter:


Board thickness

0.21mm to 7.0mm

Copper thickness

0.5 OZ to 7.0 OZ

Copper thickness in hole

>25.0 um (>1mil)


Size

Max. Board Size: 23 × 25 (580mm×900mm)

Min. Drilled Hole Size: 3mil (0.075mm)

Min. Line Width: 3mil (0.075mm)

Min. Line Spacing: 3mil (0.075mm)


Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating


Tolerance


Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076 NPTH: ±0.05

Certificate

UL, ISO 9001, ISO 14001

Special requirements

Buried and blind vias+controlled impedance +BGA

Profiling

Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.


Description


1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger


ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254 0.508 0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2

Advantages:


1) We have professional research team.

2) No MOQ,small order are aslo welcome,From Prototype to Mass production.

3) All products are 100% tested working before sent to you.

4) One stop PCB solution

5) We have professional sales team, so please do not hesitate to contact us if you have any question


Product Tags:

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